Lead-frame method and assembly for interconnecting circuits within a circuit module
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United States of America Patent
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Feb 13, 2007
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N/A
app pub date -
Jan 13, 2005
filing date -
Sep 19, 2001
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Abstract
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.
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