Method of depositing patterned films of materials using a positive imaging process

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7176114
APP PUB NO 20040126711A1
SERIAL NO

10630301

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Abstract

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The invention generally encompasses a method for forming a pattern on a substrate. The method comprises applying a precursor comprising at least one metal to a substrate to form a precursor layer, exposing a predetermined portion of the precursor layer and developing the predetermined portion of the precursor layer. The developing step removes, or at least substantially removes, the predetermined portion from the substrate, thereby forming a pattern on the substrate that comprises a remaining portion of the precursor. In one embodiment, the precursor layer comprises Ti(Pr.sup.iO).sub.2(EAA).sub.2.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SIMON FRASER UNIVERSITYBURNABY BRITISH COLUMBIA66

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blair, Sharon Louise Coquitlam, CA 1 5
Hill, Ross H Coquitlam, CA 13 230
Li, Grace Coquitlam, CA 3 16
Ruan, Haixiong Burnaby, CA 1 5
Zhang, Xin Burnaby, CA 253 1369

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ADVANCED NANOTECHNOLOGIES, INC. (1)
* 2003/0073,042 Process and materials for formation of patterned films of functional materials 34 2001
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
* 5470693 Method of forming patterned polyimide films 101 1992
* 6790579 Photoresist compositions comprising polycyclic polymers with acid labile pendant groups 40 2000
* 6723486 Photoresist compositions comprising polycyclic polymers with acid labile pendant groups 23 2001
 
3M INNOVATIVE PROPERTIES COMPANY (1)
* 2004/0087,690 Ionic photoacid generators with segmented hydrocarbon-fluorocarbon sulfonate anions 30 2002
 
INTELLECTUAL VENTURES HOLDING 40 LLC (1)
5178989 Pattern forming and transferring processes 45 1989
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (2)
5272099 Fabrication of transistor contacts 29 1992
5935762 Two-layered TSI process for dual damascene patterning 71 1997
 
SIMON FRASER UNIVERSITY (6)
5534312 Method for directly depositing metal containing patterned films 65 1994
* 6348239 Method for depositing metal and metal oxide films and patterned films 9 2000
* 6458431 Methods for the lithographic deposition of materials containing nanoparticles 32 2001
* 6723388 Method of depositing nanostructured films with embedded nanopores 14 2002
* 6787198 Hydrothermal treatment of nanostructured films 8 2002
* 2005/0285,312 Use of PMOD materials in layered (3D) manufacturing technology 6 2004
 
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM (1)
5292558 Process for metal deposition for microelectronic interconnections 76 1991
 
DAI NIPPON PRINTING CO., LTD. (1)
6387012 Metal complex solution, photosensitive metal complex solution, and method for forming metallic oxide films 7 1999
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
6307087 Ligands for metals and improved metal-catalyzed processes based thereon 68 1999
 
UNITED MICROELECTRONICS CORP. (2)
5652166 Process for fabricating dual-gate CMOS having in-situ nitrogen-doped polysilicon by rapid thermal chemical vapor deposition 22 1996
5627087 Process for fabricating metal-oxide semiconductor (MOS) transistors based on lightly doped drain (LDD) structure 10 1996
 
AVIZA TECHNOLOGY, INC. (1)
4770590 Method and apparatus for transferring wafers between cassettes and a boat 187 1986
 
KABUSHIKI KAISHA TOSHIBA (1)
5989759 Pattern forming method using alignment from latent image or base pattern on substrate 25 1998
 
SYMETRIX CORPORATION (2)
6072207 Process for fabricating layered superlattice materials and making electronic devices including same 16 1995
* 5849465 Photosensitive titanium carboxydiketonate and titanium carboxyketoester precursor solutions and method of patterning integrated circuits using the same 9 1996
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
5436176 Method for fabricating a semiconductor device by high energy ion implantation while minimizing damage within the semiconductor substrate 28 1992
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (1)
5716758 Process for forming fine pattern for semiconductor device utilizing multiple interlaced exposure masks 15 1997
 
CANON KABUSHIKI KAISHA (1)
5140366 Exposure apparatus with a function for controlling alignment by use of latent images 37 1991
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
CLICK MATERIALS CORP. (2)
9433928 Electrocatalytic materials and methods for manufacturing same 0 2012
9803287 Electrocatalytic materials and methods for manufacturing same 0 2016
 
Kemet Corporation (2)
8293323 Thin metal film conductors and their manufacture 0 2007
* 2008/0206,450 Thin metal film conductors and their manufacture 0 2007
 
YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM (1)
* 7759609 Method for manufacturing a patterned structure 3 2004
* Cited By Examiner

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