Method of depositing patterned films of materials using a positive imaging process
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United States of America Patent
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Feb 13, 2007
Issued Date -
N/A
app pub date -
Jul 30, 2003
filing date -
Jun 6, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention generally encompasses a method for forming a pattern on a substrate. The method comprises applying a precursor comprising at least one metal to a substrate to form a precursor layer, exposing a predetermined portion of the precursor layer and developing the predetermined portion of the precursor layer. The developing step removes, or at least substantially removes, the predetermined portion from the substrate, thereby forming a pattern on the substrate that comprises a remaining portion of the precursor. In one embodiment, the precursor layer comprises Ti(Pr.sup.iO).sub.2(EAA).sub.2.
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