Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
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United States of America Patent
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Feb 13, 2007
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app pub date -
Apr 26, 2005
filing date -
May 16, 2000
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Abstract
A high-speed method and system for precisely positioning a waist of a material-processing laser beam to dynamically compensate for local variations in height of microstructures located on a plurality of objects spaced apart within a laser-processing site are provided. In the preferred embodiment, the microstructures are a plurality of conductive lines formed on a plurality of memory dice of a semiconductor wafer. The system includes a focusing lens subsystem for focusing a laser beam along an optical axis substantially orthogonal to a plane, an x-y stage for moving the wafer in the plane, and a first air bearing sled for moving the focusing lens subsystem along the optical axis.
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