Positive tone bi-layer imprint lithography method
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United States of America Patent
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Feb 20, 2007
Grant Date -
Sep 30, 2004
app pub date -
Mar 25, 2003
filing date -
Mar 25, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.
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