Semiconductor device and manufacturing method thereof
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United States of America Patent
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Feb 20, 2007
Grant Date -
Nov 25, 2004
app pub date -
Oct 31, 2003
filing date -
Nov 1, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
The object is to provide a lightened semiconductor device and a manufacturing method thereof by pasting a layer to be peeled to various base materials. In the present invention, a layer to be peeled is formed on a substrate, then a seal substrate provided with an etching stopper film is pasted with a binding material on the layer to be peeled, followed by removing only the seal substrate by etching or polishing. The remaining etching stopper film is functioned as a blocking film. In addition, a magnet sheet may be pasted as a pasting member.
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