Substrate with patterned conductive layer
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United States of America Patent
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-
Feb 20, 2007
Grant Date -
Dec 29, 2005
app pub date -
Jun 24, 2005
filing date -
Jun 28, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A method of processing a substrate is provided. The method includes providing a substrate having a first surface, a second surface, and conductive paths extending from the first surface to the second surface. The method also includes (1) covering a portion of the first surface with a conductive material, and (2) removing a portion of the conductive material to define conductive traces on the first surface.
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