Interface link layer device to build a distributed network
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United States of America Patent
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-
Feb 20, 2007
Grant Date -
Oct 4, 2001
app pub date -
Dec 29, 2000
filing date -
Dec 30, 1999
priority date (Note) -
Expired
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Abstract
An interface link layer device of an interface which allows the interconnection of different networks to build a distributed network, The interface link layer routes complete data packets directly to another interface link layer device that serves the destination via uplink to accept a data packet from a first data bus that has a predetermined destination on a second data bus and to transmit the data packet via a transmission path to interface link layer device. The interface link layer also using downlink to output data packets received via the transmission path from another interface link layer device to a predetermined destination on the first data bus. Further, the interface link layer device is configured such that not all packets have to be transmitted via the interface on basis of an appropriate acknowledge code and response packet generation included in the interface link layer device.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- SONY DEUTSCHLAND GMBH
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Buchner, Peter | Kirchheim/Teck, DE | 28 | 1132 |
Gaedeken, Gralf | Weinsberg, DE | 19 | 180 |
Spalink, Gerd | Stuttgart, DE | 35 | 371 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
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