Electronic assembly having multi-material interconnects
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United States of America Patent
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Feb 27, 2007
Grant Date -
Jan 5, 2006
app pub date -
Jun 30, 2004
filing date -
Jun 30, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.
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