Surface acoustic wave apparatus
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United States of America Patent
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-
Feb 27, 2007
Grant Date -
May 5, 2005
app pub date -
Aug 5, 2004
filing date -
Aug 6, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A SAW apparatus is provided capable of realizing a small size without adverse affect while mounting the active surfaces of the semiconductor integrated circuit and the surface acoustic wave element. The SAW apparatus comprises a semiconductor IC and a SAW element. The semiconductor IC is flip-chip mounted on a bottom of the package, a non-active surface of the SAW element is bonded to a non-active surface of the semiconductor IC by using an adhesive, and an electrode portion arranged in the active surface is wire-bonded to an electrode pattern formed on the side walls of the package by using wires.
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