Fiber embedded polishing pad
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 6, 2007
Issued Date -
N/A
app pub date -
Nov 14, 2005
filing date -
Jun 23, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
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