Method to pattern a substrate
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United States of America Patent
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-
Mar 6, 2007
Grant Date -
Feb 10, 2005
app pub date -
Aug 4, 2003
filing date -
Aug 4, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An aspect of the present invention includes a method of lithography to enhance uniformity of critical dimensions of features patterned onto a workpiece. Said workpiece is coated with a coating sensitive to electromagnetic radiation. An electromagnetic radiation source having an illumination intensity is provided. At least one object pixel of electromagnetic radiation is created. A predetermined pattern is exposed, by using said at least one object pixel, on at least a portion of said workpiece in a first exposure pass with a first dose to provide less than full exposure of said coating sensitive to electromagnetic radiation. Said exposing action is repeated at least until said portion of said coating sensitive to electromagnetic radiation is fully exposed, wherein said dose is increased for every following pass. Said fully exposed coating sensitive to electromagnetic radiation is developed.
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