Polishing slurries and methods for chemical mechanical polishing
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United States of America Patent
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Mar 6, 2007
Issued Date -
N/A
app pub date -
Jan 11, 2005
filing date -
Jul 30, 2003
priority date (Note) -
Expired
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Abstract
Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent. Methods for polishing copper by chemical-mechanical planarization include polishing copper with low pressures using a polishing pad and a aqueous slurries including soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent, particles of MoO.sub.3 dissolved in an oxidizing agent, and particles of MoO.sub.2 dissolved in an oxidizing agent.
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