Etchant, method for roughening copper surface and method for producing printed wiring board
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United States of America Patent
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Mar 13, 2007
Issued Date -
N/A
app pub date -
Mar 21, 2003
filing date -
Jul 29, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An etchant and a method for roughening a copper surface each capable of permitting copper with roughened surface which exhibits acid resistance and permits a copper conductive pattern and an outer layer material to be firmly bonded to each other therethrough in manufacturing of a printed wiring board to simplify the manufacturing. The etchant may contain an oxo acid such as sulfuric acid, peroxide such as hydrogen peroxide and an auxiliary component such as an azole and chlorine. The azole may comprise benzotriazole (BTA). The chlorine may be in the form of sodium chloride (NaCl). The etchant permits a copper surface to be roughened in an acicular manner.
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