Chip level hermetic and biocompatible electronics package using SOI wafers
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United States of America Patent
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Mar 13, 2007
Grant Date -
Aug 12, 2004
app pub date -
Feb 7, 2003
filing date -
Jan 17, 2003
priority date (Note) -
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Abstract
The invention is directed to a hermetically packaged and implantable integrated circuit for electronics that is made by producing streets in silicon-on-insulator chips that are subsequently coated with a selected electrically insulating thin film prior to completing the dicing process to yield an individual chip. A thin-layered circuit may transmit light, allowing a photodetector to respond to transmitted light to stimulate a retina, for example. Discrete electronic components may be placed in the three-dimensional street area of the integrated circuit package, yielding a completely integrated hermetic package that is implantable in living tissue.
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