Electronic component placement machine having camera units with vertically overlaid apertures
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United States of America Patent
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-
Mar 20, 2007
Issued Date -
N/A
app pub date -
Jan 12, 2005
filing date -
Feb 25, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.
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