Method and apparatus for scanning a semiconductor wafer
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United States of America Patent
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Mar 20, 2007
Grant Date -
Jan 6, 2005
app pub date -
Feb 9, 2004
filing date -
Feb 21, 2003
priority date (Note) -
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Abstract
The invention is based on a method and an apparatus for scanning a semiconductor wafer (1), on-the-fly images of regions on the wafer being acquired using a camera (3). Upon a scan line changeover, a continuously curved displacement track is generated by at least partial superimposition of the relative motions between the wafer (1) and camera (3) in the direction of the scan lines and perpendicular thereto. As a result, time is saved and wafer throughput is increased.
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