Microstructure comprising a surface which is functionalized through the localized deposit of a thin layer and production method thereof
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United States of America Patent
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Mar 27, 2007
Grant Date -
Nov 17, 2005
app pub date -
Aug 25, 2003
filing date -
Aug 26, 2002
priority date (Note) -
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Abstract
An electromechanical microstructure including a first mechanical part formed in a first electrically conductive material, and which includes a zone deformable in an elastic manner having a thickness value and an exposed surface, and a first organic film having a thickness, present on all of the exposed surface of the deformable zone. The thickness of the first film is such that the elastic response of the deformable zone equipped with the first film does not change by more than 5% compared to the response of the bare deformable zone, or the thickness of the first film is less than ten times the thickness of the deformable zone.
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