Method of manufacturing a probe card
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United States of America Patent
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-
Mar 27, 2007
Issued Date -
N/A
app pub date -
Mar 4, 2005
filing date -
Jul 11, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
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