Meniscus, vacuum, IPA vapor, drying manifold
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United States of America Patent
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Apr 3, 2007
Issued Date -
N/A
app pub date -
Dec 24, 2002
filing date -
Sep 30, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface and the first conduit region is defined in a center portion of the head. The head further includes a second conduit region on the head which surrounds the first conduit region, and includes a third conduit region on the head which is defined for delivery of a second fluid to the wafer surface. The third conduit region semi-encloses the first conduit region and the second conduit region. The second conduit region enables a removal of the first fluid and the second fluid. The delivery of the first fluid and the second fluid combined with the removal by the third conduit region of the head defines a controllable meniscus.
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