Continuous contour polishing of a multi-material surface
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United States of America Patent
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Apr 3, 2007
Grant Date -
Dec 22, 2005
app pub date -
Jun 16, 2004
filing date -
Jun 16, 2004
priority date (Note) -
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Abstract
A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad.
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