Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
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United States of America Patent
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Apr 3, 2007
Grant Date -
May 11, 2006
app pub date -
Nov 15, 2005
filing date -
Jul 1, 1998
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor device includes (a) interposing an adhesive between a surface of a substrate on which an interconnect pattern is formed and a surface of a semiconductor chip on which electrodes are formed; and (b) applying pressure between the semiconductor chip and the substrate, and covering with the adhesive at least a part of lateral surfaces of the semiconductor chip that is perpendicular to the surface of the semiconductor chip on which the electrodes are formed.
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