Low cost and low dishing slurry for polysilicon CMP
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United States of America Patent
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Apr 3, 2007
Grant Date -
Aug 14, 2003
app pub date -
Feb 6, 2003
filing date -
Feb 8, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods and compositions are provided for planarizing substrate surfaces with low dishing. Aspects of the invention provide methods of using compositions comprising an abrasive selected from the group consisting of alumina and ceria and a surfactant for chemical mechanical planarization of substrates to remove polysilicon.
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