Carbon-phenol resin molding compound
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United States of America Patent
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Apr 3, 2007
Grant Date -
Feb 20, 2003
app pub date -
Aug 5, 2002
filing date -
Aug 8, 2001
priority date (Note) -
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Abstract
A carbon-phenol resin molding compound is provided, which is preferably used to obtain molded articles having high electrical and thermal conductivities as well as good mechanical strength. The resin molding compound is prepared by reacting a phenol with an aldehyde in the presence of a catalyst, while mixing them with a carbon powder such that a content of the carbon powder in the molding compound is 75 wt % or more. The catalyst is at least one selected from tertiary amines, carbonates, hydroxides and oxides of alkali metals or alkali earth metals.
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