Multi-strand substrate for ball-grid array assemblies and method
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United States of America Patent
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Apr 3, 2007
Grant Date -
Jul 8, 2004
app pub date -
Dec 19, 2003
filing date -
Dec 5, 1994
priority date (Note) -
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status (Latency Note)
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Abstract
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
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