Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy
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United States of America Patent
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Apr 3, 2007
Issued Date -
N/A
app pub date -
Jul 21, 2003
filing date -
Dec 28, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
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