Semiconductor package without bonding wires and fabrication method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 3, 2007
Grant Date -
Sep 15, 2005
app pub date -
May 9, 2005
filing date -
Jan 22, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor package without bonding wires and a fabrication method are provided. The semiconductor package includes a substrate having a front surface and a back surface, two chips formed on the front surface, two dielectric layers formed on the chips respectively, two conductive trace layers formed on the dielectric layers respectively, an insulating layer formed on one of the dielectric layers, and a plurality of solder balls implanted on the back surface of the substrate. One of the dielectric layers is formed on one of the chips and attached to an entire non-active surface of the other of the chips.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully