Semiconductor package and its manufacturing method
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United States of America Patent
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Apr 10, 2007
Grant Date -
N/A
app pub date -
Aug 19, 2004
filing date -
Aug 19, 2004
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor package comprising paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Attached to the die paddle is a semiconductor die which is electrically connected to at least some of the leads. Attached to the semiconductor die is at least one inner package. A package body encapsulates the die paddle, the leads, the semiconductor die and the inner package such that a portion of each of the leads and a portion of the inner package are exposed in the package body.
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