US Patent No: 7,205,095
Number of patents in Portfolio can not be more than 2000
Apparatus and method for packaging image sensing semiconductor chips
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Apr 17, 2007
Issued date -
Sep 17, 2003
filing date -
10/666,921
serial no -
In Force
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Abstract
An method and apparatus for fabricating a die having imaging circuitry and fabricating a lid having a transparent region and support regions having a predetermined height. The lid is fabricated by applying a photo-sensitive adhesive layer with a thickness substantially equal to the predetermined height to a transparent plate and patterning the photo-sensitive adhesive layer to form the transparent region and the support regions. Once fabrication of the lid is complete, it is mounted directly onto the die so that the transparent region generally covers the imaging circuitry. The resulting apparatus includes a lid mounted directly onto the die with the transparent region generally positioned above the imaging circuitry. A gap, having a height dimension substantially equal to the predetermined height of the support regions of the lid, is spaced between the transparent region of the lid and the imaging circuitry on the die.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 6,117,193 Optical sensor array mounting and alignment | 27 | 1999 | |
| 6,291,884 Chip-size semiconductor packages | 89 | 1999 | |
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| 6,075,237 Image sensor cover with integral light shield | 20 | 1998 | |
| 6,873,024 Apparatus and method for wafer level packaging of optical imaging semiconductor devices | 9 | 2002 | |
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| 5,818,094 Package for housing a semiconductor element | 12 | 1996 | |
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| 5,920,142 Electronic part and a method of production thereof | 54 | 1997 | |
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| 4,697,203 Semiconductor device and manufacturing method therefor | 43 | 1985 | |
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| 5,734,156 Optical device assembly and its preparation using metallic bump bonding and a stand-off for bonding together two planar optical components | 8 | 1996 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 17, 2014 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 17, 2018 |
| Fee | Large entity fee | small entity fee | micro entity fee |
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| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
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| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |