Patterning substrates employing multi-film layers defining etch-differential interfaces
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United States of America Patent
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Apr 17, 2007
Grant Date -
Mar 23, 2006
app pub date -
Sep 21, 2004
filing date -
Sep 21, 2004
priority date (Note) -
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Abstract
The present invention features a method of patterning a substrate that includes forming, on the substrate, a multi-layer film with a surface, an etch rate interface and an etch-differential interface. The etch-differential interface is defined between the etch rate interface and the surface. A recorded pattern is transferred onto the substrate defined, in part, by the etch-differential interface.
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