Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
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United States of America Patent
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Apr 17, 2007
Grant Date -
Apr 1, 2004
app pub date -
Aug 2, 2003
filing date -
Sep 17, 2002
priority date (Note) -
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Abstract
A semiconductor multi-package module having a second package stacked over a lower ball grid array first package, each package including a die attached to a substrate, in which the first and second package substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a ball grid array first package including a substrate and a die, affixing a second package including a substrate and a die onto an upper surface of the lower package, and forming z-interconnects between the first and lower substrates.
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