Ball grid array copper balancing
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United States of America Patent
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-
Apr 17, 2007
Grant Date -
Dec 30, 2004
app pub date -
Jun 30, 2003
filing date -
Jun 30, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A ball grid array device includes a substrate having a first major surface and a second major surface. The first major surface includes leads for electrical connections. The second major surface is devoid of leads. The ball grid array device also includes a first land having a solder mask opening at the first major surface of the substrate, and a second, buried land near the first major surface of the substrate. A method for forming an electronic device includes forming an electronic circuit in a substrate, placing an input pad for an input to the electronic circuit on at least one major surface of the substrate, placing an output pad for an output from the electronic circuit on the at least one major surface of the substrate, and placing an electrically isolated pad near the at least one major surface of the substrate.
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