Thermally enhanced stacked die package and fabrication method
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United States of America Patent
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Apr 17, 2007
Grant Date -
Oct 20, 2005
app pub date -
Apr 16, 2004
filing date -
Apr 16, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate is provided. A first die is attached to the substrate. The first die is electrically connected to the substrate. A heat sink having an undercut around its periphery is attached to the first die. A second die is attached to the heat sink. The second die is electrically connected to the substrate, and the first die, the heat sink, and the second die are encapsulated.
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