Load lock chamber for large area substrate processing system
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United States of America Patent
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Apr 24, 2007
Grant Date -
May 5, 2005
app pub date -
Apr 26, 2004
filing date -
Oct 20, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.
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