Power semiconductor package
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United States of America Patent
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Apr 24, 2007
Grant Date -
Jan 26, 2006
app pub date -
Jul 20, 2004
filing date -
Jul 20, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package including a relatively thick lead frame having a plurality of leads and a first lead frame pad, the first lead frame pad including a die coupled thereto, bonding wires connecting the die to the plurality of leads, the bonding wires being aluminum, and a resin body encapsulating the die, bonding wires and at least a portion of the lead frame.
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