High conductivity inks with improved adhesion

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United States of America Patent

PATENT NO 7211205
APP PUB NO 20040144958A1
SERIAL NO

10353837

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Abstract

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Conductive ink compositions which can be cured to highly conductive metal traces by means of 'chemical welding' include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.

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Patent Owner(s)

Patent OwnerAddress
PARELEC INCP O BOX 6042 LAWRENCEVILLE NJ 08648

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Conaghan, Brian F Princeton, NJ 6 77
Jablonski, Gregory A Yardley, PA 14 347
Kydd, Paul H Lawrenceville, NJ 30 1077
Mendoza, Isabel Middletown, NJ 2 46
Richard, David L Fanwood, NJ 11 283

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