Exposed lead QFP package fabricated through the use of a partial saw process
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United States of America Patent
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May 1, 2007
Issued Date -
N/A
app pub date -
Jun 30, 2004
filing date -
Sep 9, 2002
priority date (Note) -
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Abstract
A QFP exposed pad package which includes leads exposed within the bottom surface of the package body of the package in addition to those gull-wing leads protruding from the sides of the package body. Those leads exposed within the bottom surface of the package body are created through the utilization of a standard leadframe with additional lead features that are electrically isolated subsequent to a molding process through the use of a partial saw method.
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