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Abstract

A process is provided for the selective metallization of 3D structures, particularly for the selective gold-plating of 3D contact structures on wafers, such as contact bumps, which are electrically connected to a bond pad on the wafer via a three-dimensional, mechanically flexible structure in the form of a redistribution layer, for subsequent electrical connection to a carrier element, e.g., a printed circuit board. The process is intended to considerably simplify the process sequence. The metallization of the previously prepared 3D structures on the wafer is carried out electrochemically, under current or potential control, by the structures being partially immersed in an electrolyte with a fixed surface. The electrolyte can be covered with a membrane which is permeable to the corresponding ions, or alternatively a gel electrolyte may be used.

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First Claim