Laser based splitting method, object to be split, and semiconductor element chip
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United States of America Patent
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May 1, 2007
Issued Date -
N/A
app pub date -
Feb 16, 2005
filing date -
Feb 19, 2004
priority date (Note) -
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Abstract
A laser splitting method for splitting off a segment from an object to be split using a laser beam, includes a surface processing step of processing the object by forming a linear recessed portion in a surface of the object, the linear recessed portion being effective to cause a stress concentration at the surface of the object; an internal processed-region forming step of forming an internal processed-regions at a depth of the object in a line along which a laser beam scans the surface of the object by a relative motion therebetween, the laser beam being converged adjacent the depth, wherein the thus formed internal processed-regions extend in a direction substantially perpendicular to the surface of the object; and an external force applying step of applying an external force to the object to form cracks between the recessed portion and the internal processed-regions.
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