Electronic device having heat-dissipating structure for socket
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United States of America Patent
Stats
-
May 8, 2007
Grant Date -
May 18, 2006
app pub date -
Jul 1, 2005
filing date -
Nov 18, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.
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