System for processing a workpiece
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United States of America Patent
Stats
-
May 15, 2007
Grant Date -
Dec 2, 2004
app pub date -
Jun 14, 2004
filing date -
Jan 22, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system for processing a workpiece includes a process head assembly and a base assembly. The process head assembly has a process head and an upper rotor. The base assembly has a base and a lower rotor. The base and lower rotor have magnets wherein the upper rotor is engageable with the lower rotor via a magnetic force created by the magnets. The engaged upper and lower rotors form a process chamber where a semiconductor wafer is positioned for processing. Process fluids for treating the workpiece are introduced into the process chamber, optionally while the processing head spins the workpiece. Additionally, air flow around and through the process chamber is managed to reduce particle adders on the workpiece.
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