Ground arch for wirebond ball grid arrays
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United States of America Patent
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May 15, 2007
Grant Date -
Aug 17, 2006
app pub date -
Jul 30, 2004
filing date -
Jul 30, 2003
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.
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