Liquid cooling system
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United States of America Patent
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May 15, 2007
Issued Date -
N/A
app pub date -
Nov 14, 2003
filing date -
Sep 10, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.
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