Cooling systems incorporating heat transfer meshes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 22, 2007
Grant Date -
Jun 29, 2006
app pub date -
Dec 20, 2005
filing date -
Dec 23, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Apparatus for cooling of an electrical element package, comprising in combination structure including a hollow body, defining a cavity containing cooling fluid, the structure defining an opening or passage whereby direct contact of the cooling fluid with the package is established for heat transfer from the package to the fluid contained in the cavity; a mesh located to enhance the heat transfer, and means for circulating the fluid to transfer heat to other heat transfer means acting to remove heat from the fluid.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully