Devices using a medium having a high heat transfer rate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 22, 2007
Issued Date -
N/A
app pub date -
Aug 13, 2001
filing date -
Aug 13, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed is a heat transfer medium having high heat transfer rate, being useful in even wider fields, simple in structure, easy to made, environmentally sound, and capable of rapidly conducting heat and preserving heat in a highly efficient manner. Further disclosed are a heat transfer surface and a heat transfer element utilizing the heat transfer medium. Further disclosed are applications of the heat transfer element.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully