Selecting dice to test using a yield map
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 22, 2007
Issued Date -
N/A
app pub date -
Jul 28, 2004
filing date -
May 26, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Dice on a wafer are selected to be tested using a yield map. The yield map incorporates yield information of different products produced by the same fabrication process. A die placement for a product to be produced by the same process is determined based on the yield map. An expected yield for a die in the die placement is also determined based on the yield map. The expected yield for the die is then used to determine whether to test the die.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully