Thin film precursor stack for MEMS manufacturing
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United States of America Patent
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May 22, 2007
Grant Date -
Dec 30, 2004
app pub date -
Jun 24, 2003
filing date -
Jun 24, 2003
priority date (Note) -
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Abstract
This invention provides a precursor film stack for use in the production of MEMS devices. The precursor film stack comprises a carrier substrate, a first layer formed on the carrier substrate, a second layer of an insulator material formed on the first layer, and a third layer of a sacrificial material formed on the second layer.
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