Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 29, 2007
Grant Date -
Feb 23, 2006
app pub date -
Aug 19, 2004
filing date -
Aug 19, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.
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