Method of manufacturing a sensor device with binding material having a foaming agent
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 29, 2007
Grant Date -
Aug 11, 2005
app pub date -
Feb 1, 2005
filing date -
Feb 10, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A sensor device includes a sensor chip and a bonding wire being fixed on a substrate. The sensor device is manufactured by using a binding material made of an adhesive containing a foaming agent that evaporates upon exposure to heat. The binding material reduces its elasticity after a wire bonding process because voids being functional as a cushion are formed by evaporation of the foaming agent.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully