Back-face and edge interconnects for lidded package
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United States of America Patent
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May 29, 2007
Grant Date -
Apr 28, 2005
app pub date -
Sep 24, 2004
filing date -
Sep 26, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.
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